Module Tool
BGA Stencil Communication Baseband Module BGA Reballing Stencil Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P
Price
$5.61
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Description
Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Specification:
Type: for iPHone 5/5S / for iPHone 6 / for iPHone 6S / for iPHone 7 / for iPHone 8
Type: for iPHone 5/5S / for iPHone 6 / for iPHone 6S / for iPHone 7 / for iPHone 8
Package included:
1 x BGA Reballing Tool
1 x BGA Reballing Tool
Details pictures:
Product photos
Full images