S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

Module Tool

S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

Price

$7.87

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Description
Features:

3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard  for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Specification:

Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
Package included:

1 x BGA Reballing Tool
Details pictures:
Product photos
Full images
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