Module Tool
S450 3D BGA Reballing Stencil Communication Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P
Price
$6.83
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Description
Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Specification:
Type: A: for iPHone 5/5s B: for iPHone 6/6p C: for iPHone 6s/6sp D: for iPHone 7/7p E: for iPHone 8/8p
Type: A: for iPHone 5/5s B: for iPHone 6/6p C: for iPHone 6s/6sp D: for iPHone 7/7p E: for iPHone 8/8p
Package included:
1 x BGA Reballing Tool
1 x BGA Reballing Tool
Details pictures:
Product photos
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