Middle Layer
SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Pulp
Price
$9.35
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Description
Features:
Package Included:
1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
Detail Pictures:
High density, high impedance
Pure alloy compositin
Fine and sticky
Stannum planting, not bubbing
Silver containing highlight
Model: SP-X
Weight: 50g
Size: 38 x 31 x 35mm
Melting Point: 158℃
Package Included:
1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
Detail Pictures:
Product photos
Full images